ITEM

PCB

Layer number

1-12 Layer

Type of dielectric material

94hb, 94v0, CEM-1/2/3,FR-4,Teflon

Board thickness

0.1mm-5.0 mm(4mil-200mil)

PTH hole copper thickness

1/2 oz min; 3 oz max.

Process size

2 mm-----2 m

Line width/space(mil)

0.075mm(4mil)

Min drilling diameter

0.1mm(10mil)

Min Punch diameter

0.9 mm(35mil)

tolerance

Hole position

±0.075 mm(3mil)

Line width

±0.05 mm(2mil)

Diameter

PTH±0.075 mm(3mil)

NPTH±0.05 mm(2mil)

Routing dimension tolerance (edge to edge)

±0.15 mm(6mil)

±0.10 mm(4mil)

Bow and twist

0.70%-1%

Surface treating technic of pad

Nickel/ Gold Plating/ HAL(Osp)

Insulation Resistance

10K∩-20M∩

Tolerance of line width

±1mil(±25um)

Test of voltage

300V

V-cut

Panel size

110*100 mm(mil.)

660*600 mm(max.)

Board thickness

0.6 mm(24mil)mil

Tolerance

±0.1mm(4mil)

Dilled slot width

0.50mm(20mil)max

Angle

30°,45°,60°,90°

Tolerance of drilled slot (Slot size tol.>=2W)

PTH L: ±0.15 mm(6mil)

W: ±0.1mm(4mil)

Registration Tolerance of Front/Back image

0.075mm(3mil)

Multilayer P.C.B

Tolerance of innerlayer to innerlayer

4 layers:0.15 mm(6mil)max

6 layers:0.025 mm(10mil)max

Registration of innerlayer to innerlayer

±3mil (±76um)

Tolerance of Board thicknes

4 layers: ±0.13mm(5mil)

6 layers: ±0.15mm(6mil)

impedance

50 ohm±10%