Detailed Product Description

PCB

Technical Parameter
 
ITEM PCB
Layer number 1-12 Layer
Type of dielectric material 94hb, 94v0, CEM-1/2/3,FR-4,Teflon
Board thickness 0.1mm-5.0 mm(4mil-200mil)
PTH hole copper thickness 1/2 oz min; 3 oz max.
Process size 2 mm-----2 m
Line width/space(mil) 0.075mm(4mil)
Min drilling diameter 0.1mm(10mil)
Min Punch diameter 0.9 mm(35mil)
tolerance Hole position ±0.075 mm(3mil)
 Line width ±0.05 mm(2mil)
 Diameter PTH±0.075 mm(3mil)
NPTH±0.05 mm(2mil)
 Routing dimension tolerance (edge to edge) ±0.15 mm(6mil)
±0.10 mm(4mil)
 Bow and twist 0.70%-1%
Surface treating technic of pad Nickel/ Gold Plating/ HAL(Osp)
Insulation Resistance 10K∩-20M∩
Tolerance of line width ±1mil(±25um)
Test of voltage 300V
V-cut Panel size
 110*100 mm(mil.)
660*600 mm(max.)
 Board thickness
 0.6 mm(24mil)mil
 Tolerance ±0.1mm(4mil)
 Dilled slot width
 0.50mm(20mil)max
 Angle 30°,45°,60°,90°
Tolerance of drilled slot (Slot size tol.>=2W) PTH L: ±0.15 mm(6mil)
W: ±0.1mm(4mil)
Registration Tolerance of Front/Back image 0.075mm(3mil)
Multilayer P.C.B Tolerance of innerlayer to innerlayer 4 layers:0.15 mm(6mil)max
  6 layers:0.025 mm(10mil)max
 Registration of innerlayer to innerlayer ±3mil (±76um)
 Tolerance of Board thicknes 4 layers: ±0.13mm(5mil)
  6 layers: ±0.15mm(6mil)
 impedance 50 ohm±10%